Teradyne builds automated test equipment (ATE)

Tests on a device unter test (DUT)

Do wafer level testing or packaged parts

Do a lot of Soc (System on a Chip) which basically is a chip with all
of the features of a computer plus some application specific stuff all
on a single substrate. It will likely have a microcontroller or
microprocessor, and could have any of - a graphics processing unit (GPU),
a Wi-Fi module, a coprocessor, memory (RAM, ROM, EEPROM, Flash, ...),
ADC's, DAC's, external interfaces (USB, FireWire, Ethernet, USART, SPI),
voltage regulators and power management circuits

A SiP is similar to an SoC, but "System in a Package"

Field Programmable Gate Array --> FPGA
Complex Programmable Logic Device --> CPLD

PMIC --> Power Management IC. Typically has DC-DC converters, battery charging,
power source selection, votlage scaling, voltage regulation, power sequencing
Apple 338S1164 PMIC manufactured by Dialog Semiconductors
MediaTek MT6329BA PMIC used in LG mobile phones

Teradyne Divisions

Semiconductor Test

  Digital / Mixed Signal

    UltraFLEX
      UltraFLEX-HD (12-slot), UltraFLEX-SC (24-slot), UltraFLEX-XC (36-slot)
      Options - (many others avail)
        UltraVI80 - 80 independent pins of "3-in-1" capability -  voltage
          source / current source / measurement. Termed "VI" function
        DC30 and DC75 - voltage/current supplies extend DC capability to 30V
          and 75V. Contain precision voltmeter and time measurement

    J750 is the industry standard cost-effective microcontroller, FPGA,
      digital audio/baseband devices. Used for wafer sort and final test
      RF options --> LitePoint IQxel-M and IQxtream


  Linear, Power & Automotive
    ETS-800 --> automotive test platform --> automotive IC's, power and
      battery management, high-efficiency lighting and LED drivers, motor
      controllers, general purpose analog and mixed-signal devices.
      Options include 
        APU-32 --> 32 channel 80V four quadrant VI with 8 current
          ranges from 1uA to 200mA and per pin AWG and digitizing capabilities
        SPU-2112 (smart pin 100V / 10A) +- 100V with 8 current ranges
        UPU-64 --> 64 channels 20 MHz high voltage digital (-1V to +24V), 2x8
           force / sense mux, PMU

    FLEX / microFLEX - cost efficient audio, video, power management,
      automotive, hard disk drive controllers, low cost mixed-signal devices,
      low cost analog devices






   Memory
     Magnum --> low cost non-volitile memory, SRAM, and logic devices
       50 MHz pattern rate and 100Mbps DDR (double data rate)
     Magnum V --> ultra-high performance FLASH and DRAM memories




        

Teradyne has three principal families of testers
  J750
  FLEX
  UltraFlex - SoC capable including mixed signal

  Assembly Test Division builds testers for completed circuit boards
  








Industrial automation is a more general term and collaborative robots would
fall into this catagory, which is the Universal Robots division. (Cobots)